Focusing on Advanced Packaging & Ultra-Clean Processes! LBY Demonstrates Next-Gen "Dry Cleaning & Vacuum Adsorption" Technologies

To address the stringent cleanliness demands driven by AI chips and 3D packaging, LBY will showcase its latest high-performance "Dry Ultrasonic Cleaner (DUC)" and "Micro-Porous Vacuum Markless Chuck" technologies during the exhibition, empowering leading semiconductor and optoelectronic manufacturers to boost automated production line yields.

Exhibition Highlights Overview

Upgraded Particle Removal Efficiency: Next-level dry ultrasonic technology engineered for precise sub-micron particulate removal.
Zero-Mark Substrate Handling: Specialized micro-porous and electrostatic chuck modules resolve handling challenges for thin substrates and wafer warping.
Electronic-Grade Ultra-Clean Filtration: Sourcing top-tier global absolute filter cartridges and bags to meet ultra-pure chemical and gas filtration demands.

Navigating the Advanced Packaging Wave: The Invisible Guardian of Yield Rate Control

With the rapid adoption of advanced packaging (CoWoS / Fan-Out) and Chiplet architectures, surface cleanliness standards prior to chip stacking and substrate bonding have reached unprecedented levels. Any minute particulate residue or clamping stress mark can cause packaging failures and significant financial losses.

The LBY engineering team has long focused on micro-contamination control and automated equipment integration. The integrated solutions showcased here are specifically optimized for next-generation materials—including Glass Core substrates, thinned wafers, and Micro LED display panels—delivering the most robust cleanliness and handling defense line.

Three Core Technology Showcase Focuses

Dry Ultrasonic Cleaner (DUC)

Utilizes a patented non-contact design combining powerful airflow and acoustic vibration to efficiently strip micro-particles without touching delicate substrate surfaces.

Micro-Porous Vacuum & Electrostatic Chucks

Features high-uniformity holding force that flattens thin substrates without causing pressure marks or ESD residue, substantially increasing robotic pick-and-place success rates.

Dielectric Barrier Discharge (DBD) Plasma

High-density plasma output technology designed for continuous inline surface modification of large glass substrates and thin films, significantly enhancing adhesive bonding and coating performance.

Deep-Rooted Localized Support: Welcome On-Site Exchanges & Feasibility Assessments

Guided by the philosophy of "Technological Excellence, Customer First," LBY delivers professional equipment backed by rigorous local installation, debugging, and post-sales technical support. If you have requirements for yield optimization, particle removal, or markless transfer on your line, we welcome you to schedule a technical discussion and feasibility sample testing with our team.

Schedule an On-Site Technical Consultation & Sample Assessment

Connect with LBY senior technical consultants today to explore tailored equipment integration options for your production line and overcome precision manufacturing yield bottlenecks together.

Book an Expert Consultation →

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