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2026-08-31Practicing ESG Sustainable Manufacturing!
In response to global net-zero carbon emission trends and decarbonization expectations across the semiconductor supply chain, LBY announced next-generation plasma equipment featuring low gas consumption and high power factor energy savings. Combined with long-lasting eco-friendly electronic-grade absolute filter media, LBY empowers clients to achieve both maximum yield rates and green transformation.
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2026-08-31Focusing on Advanced Packaging & Ultra-Clean Processes!
To meet strict cleanliness demands for AI chips and 3D packaging, LBY will showcase its latest high-performance "Dry Ultrasonic Cleaner (DUC)" and "Micro-Porous Vacuum Markless Chuck" technologies at the exhibition, helping semiconductor and optoelectronic leaders boost automated line yields.
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2026-08-31Overcoming Micron-Level Yield Bottlenecks
As semiconductor and advanced display processes advance to finer nodes, airborne molecular contamination (AMC) and micro-particles become critical to yield rates. LBY integrates atmospheric/vacuum plasma, dry ultrasonic cleaning, and precision chuck technology to deliver turnkey ultra-clean transformation solutions for industry leaders.